Printed Electronics Gets Its First Design Guide as IPC/JPCA-2291 Launches
Recently, IPC-Association Connecting Electronics Industries® and JPCA jointly released the IPC/JPCA-2291 Printed Electronics Design Guide. The document sets out design requirements for consistency and manufacturability in printed electronics.
The IPC/JPCA-2291 Printed Electronics Design Guide was jointly issued by the two organizations on July 30. Together with IPC/JPCA-4921 Printed Electronics Substrate Requirements and IPC/JPCA-4591 Printed Electronics Functional Materials Requirements, it builds a solid foundation for the expanding range of printed electronics applications.
Printing conductors on substrates is not a new idea, but the low manufacturing cost advantage of printed electronics keeps spawning new markets and technologies, while a variety of substrates also makes products of arbitrary shapes possible. In addition, printed electronics uses additive processes with fewer steps and simpler manufacturing, which can greatly reduce the environmental pollution caused by etching in subtractive processes and cut compliance time.
Research in printed electronics remains at an early stage, and this design guide summarizes current best practices among companies in the field. Marc Carter, IPC's director of technology transfer, said: 'Printed electronics technology is changing rapidly, and standards should reflect industry best practices in a timely manner. After IPC/JPCA-2291 is published, we will immediately begin revising this guide. IPC will join hands with JPCA to invite more companies to take part in developing the design guide. I also hope more printed electronics professionals will join our standards development working group.'
IPC is also developing other printed electronics standards, including IPC/JPCA-6901 Performance Requirements for Printed Electronics Assemblies and an as-yet-unnamed printed electronics process guide. At the same time, IPC is developing a printed electronics technology roadmap to help the industry identify needs and strengths.
—This article is reprinted from China Packaging Network (pack.cn); original link: http://news.pack.cn/show-361882.html
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