15-Day Countdown: 2019 China Electronic Industry Product Packaging Summit Forum Set for Shaoxing, Sept 18-20

The 2019 China Electronic Industry Product Packaging Summit Forum is scheduled for September 18-20 in Shaoxing, with only 15 days remaining before registration closes.

September 18-20, Shaoxing, Zhejiang.

2019 China Electronic Industry Product Packaging Summit Forum.

The annual electronic packaging gathering is about to begin!!!

Packaging industry representatives already registered include —

Zhejiang Xiwang Packaging, Qingdao Kaituo Technology, Huimeizhuang Group, Rongfeng Supply Chain, Jinsheng Packaging, Bendi Packaging, Shanghai Airbei, Foshan Tepugao, Asia-Pacific Packaging, Ningbo Xiyue, Jiangzhiyuan, Jiangnan University, Zhongshan Torch Polytechnic, Amcor International Containers, Reed Exhibitions, Adsale Exhibition, Huayin Media, Suzhou Dacheng, Hefei Dansheng, Tianjin Maohai, Wuhan Yadu, Shenzhen Prince Packaging, Hangzhou Pinxiang Technology, Dongguan Chuangwei, Dongguan Yuexing, Guangzhou Nanya, Yinuo Anti-rust, Huayuan New Materials, Ronghua Offset, Zhixin Packaging, Zhongju Packaging, Jiebao Biomass, Lilian Paper Products, Mingfeng Packaging, Zhiwei New Materials, Dongyuan New Materials, Cairun Packaging, Dongguan Tengliyuan, Wuhan Xintiandi, Wuxi Chengde Machinery, Xi'an Gaohui, Baolihui Honeycomb, Xingyi Packaging, Haifang Technology, Shangfeng Packaging, Lianhuan Packaging, Shengwei Packaging, Ruifeng Packaging, Zhidian Composite Materials, Hanrui Packaging, Panyu Huali, Runlin Packaging, Dongguan Huilin, Shenzhen Guangdayuan Film, Biaoneng Industrial, Hengtai Huaye, Xinxiangheng Packaging, Hongbo Century, Xiehelong, Foshan Fengyuan, Dongguan Chuangwei Adhesive Technology, Guangdong Lvsen Supply Chain, Shenzhen Beihua Plastics, Foshan Jiameili Packaging, Anhui Diweiluo, Xuzhou Tianchen Paper Products, Forest Packaging Group, Dongguan Yisheng Packaging, Zhongshan Senbao Paper, Hangzhou Lin'an Jinxing Packaging, Fujian Qinwei Optoelectronics, Shanxi Fenyang Xinghuacun Wenji Gift Box, Yongfa Henan Molding Technology, Liansheng Color Printing Group, Zhejiang Xinhengtai New Materials, Beijing Jingdong Longda Honeycomb, Anhui Jiecheng Packaging, Chaozhou Hongtu Printing, Jiangyin Weihang Paper, Changsha Jingda Printing Plate Making, Shantou Jinggong Dongjie Plate Making, Beijing Kaiteng Jinggong Plate Making, Zhongshan Shunguang Packaging, Woods Material Handling Products (Suzhou), Shenzhen Moma Technology, Manroland, Xunbaozhuang Network, Shanying International Xiangheng Creative Packaging, Henan Anti-counterfeiting and Confidential Printing Company, Ningbo Fushan Paper ......

(Registration is still in full swing...)

Note: The above list is in no particular order.

End-user enterprises already registered include —

China Star Optoelectronics, TCL Electronics, TCL Air Conditioner, Robam Appliances, AUX, Bade Kitchen & Bath, Vatti Corporation, Zhejiang Lianyi Motor, Galanz, Bull Group, Qingdao Topscomm Communication, Fujian Star-net Ruijie, Chigo Air Conditioning, Gree Electric Appliances, Yunnan China Tobacco, Midea Air Conditioning, Toshiba Logistics (Hangzhou), Midea Refrigerator, Midea Washing Machine, Chongqing Weibo Power Technology, Wingtech Technology, Midea Small Domestic Appliances, Midea Dishwasher, Fotile Kitchenware, Lenovo, Skyworth Air Conditioner, Skyworth TV, Melaleuca Nantong Health Technology, Hisense TV, Hisense Refrigerator, Xiamen Sanshuo Electronic Technology, Hisense Washing Machine, Shenzhen Megmeet, Yechu Commercial (Shenzhen), Shenzhen Zhimeida, OSRAM, Opple Lighting, CommScope, A.O. Smith, Wistron, Haier Air Conditioning, Cainiao Logistics, Haier Refrigerator, Haier TV, Foxconn Group, Inspur Group, Meige'er, Homa Refrigerator, ZTE Technology, Chint Electric, Changhong Group, Hikvision, Viomi Technology, Lanhe Technology, NetEase Yanxuan, Shanghai Packaging ......

(Registration is still in full swing...)

September 18

13:00-20:00 Delegate registration

September 19

Packaging Summit Forum

Moderator: Huang Shengwen

08:30-09:00 Forum opening, Huang Shengwen

09:00-09:15 Address by Electronics Committee leader, Ye Baizhang

09:15-09:25 Address by Zhejiang Packaging Association leader, Association leader

09:25-09:35 Address by Zhejiang Xiwang Packaging leader, Company leader

09:35-10:00 Annual keywords for electronics industry packaging, Huang Shengwen

10:00-10:25 New processes to reduce carton production costs, Xia Weilong

10:25-10:50 Fully automatic dry-end equipment solutions for corrugated board production lines, Cui Jinbao

10:50-11:15 Drop simulation analysis and effectiveness for packaged products, Lu Lixin

11:15-11:40 Haier's new requirements for green packaging in the new era, Lu Junfeng

11:40-12:00 Group photo of all delegates (hotel entrance), Xiwang Packaging

12:00-13:00 Lunch (business buffet, with meal voucher)

13:30-13:55 High-end printing technology boosts packaging enterprises, Kang Jianguo

13:55-14:20 EPP application trends in industrial packaging, Hu Yazhou

14:20-14:45 Under the plastic restriction order, paper packaging for home appliances creates another green wave, Du Zhijian

14:45-15:10 Innovative e-commerce packaging applications, trends and demands, Liu Jian

15:10-15:35 Moisture failure analysis and solutions for electronics industry products, He Xianpei

15:35-15:45 Tea break

15:45-16:10 New packaging species — high-strength, low-cost suspended fastening film, Liu Mingfa

16:10-16:35 Carbon-emission-based optimization of Gree packaging green design, Zhang Xiongfei

16:35-17:00 Intelligent inspection and quality big-data analysis for carton transport packaging, Su Hongbo

17:00-17:25 Application and business model of new environmentally friendly recycled pallets, Xia Zerong

17:25-17:50 Packaging design and testing from an omnichannel supply chain perspective, Huang Changhai

18:30-20:30 Group dinner (Xiwang Night)

September 20

08:30-08:40 Forum opening session, Huang Shengwen

08:40-09:05 Total packaging solutions support sustainable development, Chen Shili

09:05-09:30 E-commerce logistics packaging solutions for home appliances, Zong Yuan

09:30-09:55 ---------------- Reserved for suppliers, end users on standby

09:55-10:20 ---------------- For

10:20-10:45 A new protection technology for home appliance packaging, Xiao Xiao

10:45-11:10 Failure analysis and solutions for hot-melt adhesive bonding of packaging materials, Che Jianlong

11:10-11:35 Automation development of packaging machinery becomes a trend, Yang Ying

11:35-12:00 The story of kitchen appliance packaging, Wang Yingjie

12:00-13:00 Lunch (business buffet, with meal voucher)

Packaging Hot Topics Salon

Moderator: Huang Shengwen

13:40-14:00 Salon opening, Huang Shengwen

14:00-17:00 Packaging Hot Topics Salon, Huang Shengwen, Zong Yuan

18:30-20:30 Group dinner (Kaituo Dinner)

08:30-11:30 Forum concludes, delegates check out and return

The agenda is laid out in full detail

The schedule is compact and efficient

Each session was

weighed carefully and hand-picked

No minute of our guests should be wasted

If you choose to attend, we will not hold back

Venue: New Century Grand Hotel Shaoxing, Zhejiang, China

——Reprinted from China Packaging Network (pack.cn), original link: http://news.pack.cn/show-352904.html